What is ERI?

ERI Structure

ERI Overview

On June 1, 2017, the DARPA Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling. ERI draws on new and existing DARPA programs to make a significant investment into enabling circuit specialization and managing complexity. Building on the tradition of other successful government-industry partnerships, ERI aims to forge forward-looking collaborations among the commercial electronics community, defense industrial base, university researchers, and the Department of Defense to create a more specialized, secure, and heavily automated electronics industry that serves the needs of both defense as well as the domestic commercial sectors.

ERI Background

Moore’s Law, defined on pages one and two of Gordon Moore’s seminal 1965 paper entitled “Cramming More Components onto Integrated Circuits,” has guided the electronics industry for more than 50 years. The continued realization of this Law, however, is challenged on both technical and economic grounds. Page three of Moore’s paper described research areas required to manage this possibility. In deference to Moore’s ideas, ERI investments are organized into the areas he described - Architectures, Designs,and Materials and Integration. In July 2018, DARPA kicked off six “Page 3”programs aligned to these three research thrust areas:

  • The Architectures Thrust asks whether the electronics community can enjoy the benefits of specialized circuitry while still relying on general programming constructs through proper software/hardware co-design (DSSoC, SDH).
  • The Materials and Integration Thrust asks whether the integration of unconventional materials can enhance conventional silicon circuits and continue the progress traditionally associated with scaling (FRANC, 3DSoC).
  • The Designs Thrust asks whether the electronics community can dramatically lower the barriers to modern system-on-chip design and unleash a new era of circuit and system specialization and innovation (POSH, IDEA).  

In November 2018, DARPA commenced with ERI Phase II, again launching six new programs aligned to the three existing thrusts. These six programs will close out ERI Phase II. Two new materials programs, Photonics in the Package for Extreme Scalability (PIPES) and Technologies for Mixed-mode Ultra Scaled Integrated Circuits (T-MUSIC), aim to create unique and differentiated domestic manufacturing capabilities accessible to the DoD. Two new architectures programs, Guaranteed Architecture for Physical Security (GAPS) and Digital RF Battlespace Emulator (DRBE), and two new designs programs, Automatic Implementation of Secure Silicon (AISS) and Real Time Machine Learning (RTML), aim to ensure the security of sensitive electronics and data to demonstrate that specialized circuits can address emerging defense and commercial applications, such as artificial intelligence. GAPS and AISS specifically respond to a growing commercial and defense sector demand for integrating security and privacy into electronic systems, either through system architecture or circuit design. With these investments, ERI will approach new circuit designs with both security and performance in mind.

Dr. William Chappell

MTO Director

Yes, the deal is real.
We will have our first ERI Summit!




We are expecting more than 160
attendees this year. Limited seats available, get yours today!



We are expecting more than 290
attendees this year. Limited seats available, get yours today!



We are expecting more than 290
attendees this year. Limited seats available, get yours today!